Sebtember 13, 2024, Resonac wuxuu ku dhawaaqay dhismaha dhisme cusub oo wax soo saar oo loogu talagalay SiC (silicon carbide) wafers koronto oo loogu talagalay semiconductors-keeda Yamagata Plant ee magaalada Higashine, Yamagata Prefecture. Dhamaystirka ayaa la filayaa rubuci saddexaad ee 2025.
Xaruntan cusub waxa ay ku yaalaan gudaha Yamagata Plant ee hoos timaada, Resonac Hard Disk, waxayna yeelan doontaa aag dhisme oo dhan 5,832 mitir oo laba jibbaaran. Waxay soo saari doontaa wafers SiC (substrates iyo epitaxy). Bishii Juun 2023, Resonac waxay shahaado ka heshay Wasaaradda Dhaqaalaha, Ganacsiga iyo Warshadaha taasoo qayb ka ah qorshaha hubinta saadka ee agabyada muhiimka ah ee loo qoondeeyay sida hoos timaada Xeerka Horumarinta Amniga Dhaqaalaha, gaar ahaan agabka semiconductor (Wafers SiC). Qorshaha hubinta sahayda ee ay ansixisay Wasaaradda Dhaqaalaha, Ganacsiga iyo Warshadaha ayaa u baahan maalgashi dhan 30.9 bilyan yen si loo xoojiyo awoodda wax soo saarka wafer ee SiC ee saldhigyada magaalada Oyama, Ismaamulka Tochigi; Magaalada Hikone, Gobolka Shiga; Magaalada Higashine, Gobolka Yamagata; iyo Ichihara City, Chiba Prefecture, oo leh kaalmo ilaa 10.3 bilyan yen.
Qorshuhu waa in la bilaabo siinta waferrada SiC (substrates) ee Oyama City, Hikone City, iyo Higashine City Abriil 2027, iyada oo leh awood wax soo saar sannadkii 117,000 xabbadood (oo u dhiganta 6 inji). Bixinta waferrada SiC epitaxial ee Magaalada Ichihara iyo Magaalada Higashine ayaa loo qorsheeyay inay bilaabato Maajo 2027, iyada oo la filayo in awood sanadle ah oo dhan 288,000 (aan isbeddelin).
Sebtember 12, 2024, shirkadu waxay qabatay xaflad dhagax-dhig ah oo ka dhacday goobta loo qorsheeyay in laga dhiso warshadda Yamagata.
Waqtiga post: Seb-16-2024