ASML, oo ah hormuudka caalamiga ah ee nidaamyada lithography-ga semiconductor-ka, ayaa dhawaan ku dhawaaqday horumarinta tignoolajiyada lithography-ga cusub ee aadka u daran ee ultraviolet (EUV). Tiknoolajiyadani waxaa la filayaa inay si weyn u horumariso saxnaanta wax soo saarka semiconductor-ka, taasoo suurtogalinaysa soo saarista jajabyada leh astaamo yaryar iyo waxqabad sare.
Nidaamka cusub ee lithography-ga EUV wuxuu gaari karaa xallinta ilaa 1.5 nanometer, taasoo ah horumar la taaban karo marka loo eego jiilka hadda jira ee qalabka lithography-ga. Saxnaantan la xoojiyay waxay saameyn weyn ku yeelan doontaa agabka baakadaha semiconductor-ka. Marka jajabyadu ay yaraadaan oo ay sii adkaadaan, baahida loo qabo cajalado side sax ah oo sareeya, cajalado daboolan, iyo giraangiraha si loo hubiyo gaadiidka iyo kaydinta badbaadada leh ee qaybahan yaryar ayaa kordhi doona.
Shirkaddayadu waxay ka go'an tahay inay si dhow ula socoto horumarkan tignoolajiyada ee warshadaha semiconductor-ka. Waxaan sii wadi doonnaa inaan maalgelin ku sameyno cilmi-baarista iyo horumarinta si aan u horumarinno agabka baakadaha ee dabooli kara shuruudaha cusub ee ay keentay tignoolajiyada cusub ee ASML, iyadoo la siinayo taageero la isku halleyn karo oo loogu talagalay habka wax soo saarka semiconductor-ka.
Waqtiga boostada: Febraayo-17-2025