SAN JOSE -- Samsung Electronics Co. waxay bilaabi doontaa adeegyo baakad saddex-geesood ah (3D) oo loogu talagalay xusuusta-bandwidth-sare (HBM) gudaha sanadka, tignoolajiyada la filayo in loo soo bandhigo nooca jiilka lixaad ee farsamada HBM4 ee 2025, sida laga soo xigtay shirkadda iyo ilaha warshadaha.
Bishii Juun 20keedii, chipmaker-ka ugu weyn adduunka ayaa daaha ka qaaday tignoolajiyada baakad ee ugu dambeysay iyo khariidado adeeg ee Madasha Foundry Forum 2024 ee lagu qabtay San Jose, California.
Waxay ahayd markii ugu horeysay ee Samsung ay siideyso tignoolajiyada baakadaha 3D ee chips-yada HBM munaasabad dadweyne.Waqtigan xaadirka ah, chips-yada HBM waxaa inta badan lagu xiraa tignoolajiyada 2.5D.
Waxay timid qiyaastii laba toddobaad ka dib markii aasaasaha Nvidia iyo madaxa fulinta Jensen Huang uu soo bandhigay qaab dhismeedka jiilka cusub ee aaladeeda AI ee Rubin inta lagu guda jiro khudbad Taiwan.
HBM4 waxay u badan tahay inay ku dhex milmi doonto nooca Nvidia ee Rubin GPU-ga cusub ee la filayo inuu ku soo baxo suuqa 2026.
XIDHIIDHKA TOOSA
Tignoolajiyada baakadaha Samsung ee ugu dambeeyay waxay ka kooban tahay chips-ka HBM oo si toosan ugu dul-saaran GPU-da si loo sii dardargeliyo barashada xogta iyo habaynta fikradda, tignoolajiyada loo arko inay tahay beddelka ciyaarta suuqa-soo-saarka AI chip-ka.
Waqtigan xaadirka ah, chips-yada HBM waxay si toos ah ugu xidhan yihiin GPU-ga dhex-dhexaadiyaha silikon ee hoos yimaada tignoolajiyada baakada 2.5D.
Marka la barbardhigo, baakadaha 3D uma baahna interposer silikoon, ama substrate khafiif ah oo dhex fadhiya chips si loogu ogolaado inay wada xiriiraan oo ay wada shaqeeyaan.Samsung waxa ay tignoolajiyadeeda cusub ee baakadaha u magacawday SAINT-D, oo u gaaban Samsung Advanced Interconnection Technology-D.
ADEEGGA TURNKEY
Shirkadda Kuuriyada Koonfureed ayaa la fahamsan yahay inay bixiso baakadaha 3D HBM oo ku saleysan furaha.
Si taas loo sameeyo, kooxdeeda baakadaha horumarsan waxay si toos ah isugu xidhi doonaan chips-yada HBM ee laga soo saaray qaybteeda meheradda xusuusta GPU-yada oo ay isugu soo ururiyeen shirkado aan faa'iido lahayn oo ay ka kooban tahay qaybteeda aasaaska.
"Baakadaha 3D waxay yaraynaysaa isticmaalka korantada iyo habaynta dib u dhigista, hagaajinta tayada calaamadaha korantada ee chips semiconductor," ayuu yiri sarkaal ka tirsan Samsung Electronics.Sannadka 2027, Samsung waxa ay qorshaynaysaa in ay soo bandhigto teknoolojiyadda is-dhexgalka oo dhan-in-mid ka kooban walxaha indhaha kuwaas oo si weyn u kordhiya xawaaraha gudbinta xogta semiconductor-ka hal xirmo oo midaysan oo ah dardar-geliyayaasha AI.
Iyadoo la raacayo baahida sii kordheysa ee chips-ka hooseeya, waxqabadka sare, HBM waxaa la saadaalinayaa inay ka dhigto 30% suuqa DRAM sanadka 2025 laga bilaabo 21% sanadka 2024, sida laga soo xigtay TrendForce, shirkad cilmi baaris oo Taiwanese ah.
Cilmi-baarista MGI ayaa saadaalisay suuqa baakadaha horumarsan, oo ay ku jiraan baakadaha 3D, inuu kori doono $80 bilyan marka la gaaro 2032, marka la barbar dhigo $34.5 bilyan sanadka 2023.
Waqtiga boostada: Jun-10-2024