San Jose - Samsung Electronic tirdiolonics-ka Co. ayaa bilaabi doonta qawaaniin saddex-cabbir ah oo loogu talagalay xusuusta sare (HBM), tikniyoolajiyad ayaa la filayaa in loo yaqaan 'Sirdoonka' Sirdoonka 'Sirdoonka' ee 'HBM4'
Bishii Juun 20, dibifalka ugu weyn ee xusuusta ugu weyn ee adduunka ayaa shaaca ka qaaday tikniyoolajigiisa Tilmaamaynta Chip iyo Qormada Adeegga ee Samsung Fallry Fallry Madasha 2024 ee lagu qabtay San Jose, California.
Waxay ahayd markii ugu horreysay ee loosameeyo in la sii daayo tikniyoolajiyada 3D ee ka buufinta ee HBM Chips ee dhacdo dowladeed. Xilligan, Chips-ka HBM waxay ku xirnaadaan inta badan tikniyoolajiyadda 2.5D.
Waxay timid ku dhawaad labo isbuuc ka dib markii aasaasaha loo yaqaan 'NVIDIA' iyo madaxa fulinta Jensen Huand oo shaaca ka qaaday dhismaha qarxa-dhexe ee qaab dhismeedka hore ee Plain ee Rubin inta lagu gudajiray Taiwan.
HBM4 waxay u badan tahay in lagu dhejiyo Moodhka cusub ee Nvidia GPU ee la filayo inuu ku dhufto suuqa 2026.
Xiriir toosan
Tiknolojiyadda Baakadaha ugu dambeeyay ee Samsung ayaa muujinaya in chips-ka si toos ah loogu xiro HBM Chips oo si toos ah loogu xiro GPU si loo dardar geliyo xawliyada barashada iyo istiraatiijiyadda lagu muujiyey in la beddelo suuqa ciyaarta ee ku-koraya ee AI.
Waqtigaan la joogo, HBM Chips-ka ayaa si toos ah ula xiriiraya GPU on silicon isweydaarsi ku hoos jira tikniyoolajiyadda baakadaha 2.5D.
Marka la barbardhigo, baakadaha 3D uma baahna silicon is-dhexgal, ama substrate khafiif ah oo dhex fadhiya inta u dhaxaysa jahwareerka si loogu oggolaado inay wada xiriiraan oo ay wada shaqeeyaan. Samsung ayaa ku takhasusay tikniyoolajiyaddii baakadaha cusub ee Saint-D, oo ka gaabinaysa Samsung Thinknolojiyad isku xira Samsung
Adeegga Burcad
Shirkadda South Korene-ka ayaa la fahamsan yahay inay bixiso baakadaha 3D HBM ee ku saleysan jeexan.
Si sidaas loo sameeyo, kooxdeeda baakadaha ee horumarsan ayaa si toos ah u xidhma inay si toos ah u xidhxi doonaan HBM Chips-ka ee laga soo saaray qeybta ay ka heysato GPUs oo ay ku soo aruurisay shirkadaha xafladaha ee GPUS.
"Baakadaha 3D waxay yareysaa isticmaalka korantada iyo dib-u-dhacyada dib-u-dhaca, hagaajinta tayada calaamadaha korantada ee chinatler-ka Semiconductor Chips," ayuu yidhi sarkaalka elektaroonigga samsung. Sanadkii 2027, Samsung waxay qorsheyneysaa inay soo bandhigto tikniyoolajiyadda is dhexgalka ee hal-abuurka ah ee ah in ay ku midoobaan walxaha indhaha ee si weyn u kordhin jirada xargaha xogta xargaha xargaha hal xirmooyin mideysan.
Iyada oo la raacayo baahida sii kordheysa ee awoodda-hoose, chips waxqabadka sare, HBM waxaa la saadaalinayaa in ay ka kooban tahay 30% suuqa Dram ee 2025 laga soo bilaabo 21% 2024, sida uu sheegayo shirkadda cilmi-baarista ee Taiwanese.
Saadaalinta MGI ee suuqa Baakadaha Sare, oo ay ku jiraan baakadaha 3D, si ay ugu koraan $ 80 bilyan oo ah 2032, marka la barbar dhigo $ 34.5 bilyan 2023.
Waqtiga Post: Jun-10-2024