SAN JOSE -- Shirkadda Samsung Electronics Co. waxay bilaabi doontaa adeegyo baakad saddex-geesood ah (3D) oo loogu talagalay xusuusta bandwidth-ka sare (HBM) sanadka gudahiisa, tiknoolajiyad la filayo in lagu soo bandhigo nooca HBM4 ee jiilka lixaad ee chip-ka sirdoonka macmalka ah oo la filayo inuu soo baxo 2025, sida laga soo xigtay shirkadda iyo ilo wareedyo warshadeed.
Juun 20, shirkadda ugu weyn adduunka ee sameysa chip-ka xusuusta ayaa soo bandhigtay tignoolajiyada ugu dambeysay ee baakadaha chip-ka iyo khariidadaha adeegga ee Samsung Foundry Forum 2024 oo lagu qabtay San Jose, California.
Waxay ahayd markii ugu horreysay ee Samsung ay soo saarto tiknoolajiyada baakadaha 3D ee jajabyada HBM munaasabad dadweyne. Waqtigan xaadirka ah, jajabyada HBM waxaa inta badan lagu xiraa tiknoolajiyada 2.5D.
Waxay timid qiyaastii laba toddobaad ka dib markii aasaasaha iyo madaxa fulinta ee Nvidia Jensen Huang uu shaaca ka qaaday qaab-dhismeedka jiilka cusub ee madalkiisa AI Rubin intii lagu jiray khudbad uu ka jeediyay Taiwan.
HBM4 waxay u badan tahay inuu ku dhex milmi doono qaabka cusub ee Nvidia ee Rubin GPU oo la filayo inuu suuqa soo galo sanadka 2026.
XIRIIRKA TOOSKA AH
Tiknoolajiyadda ugu dambeysay ee baakadaha ee Samsung waxay leedahay jajabyada HBM oo si toosan loogu dul saaray GPU si loo sii dardargeliyo barashada xogta iyo habaynta gunaanadka, tignoolajiyad loo arko inay wax ka beddeshay suuqa chips-ka AI ee si xawli ah u koraya.
Waqtigan xaadirka ah, jajabyada HBM waxay si toosan ugu xiran yihiin GPU oo ku yaal is-dhexgale silicon ah iyadoo la adeegsanayo tiknoolajiyada baakadaha 2.5D.
Marka la barbardhigo, baakadaha 3D uma baahna dhex-dhexaadiye silicon ah, ama substrate khafiif ah oo dhex fadhiista jajabyada si ay u wada xiriiraan oo ay u wada shaqeeyaan. Samsung waxay tignoolajiyadeeda cusub ee baakadaha ugu magac dartay SAINT-D, oo loo soo gaabiyo Samsung Advanced Interconnection Technology-D.
ADEEGGA TURNKEY
Shirkadda Kuuriyada Koonfureed ayaa la fahansan yahay inay bixiso baakadaha 3D HBM iyadoo ku saleysan furaha.
Si ay sidaas u sameyso, kooxdeeda baakadaha ee horumarsan waxay si toosan isugu xiri doonaan jajabyada HBM ee laga soo saaro qaybteeda ganacsiga xusuusta iyo GPU-yada loo diyaariyey shirkadaha been abuurka ah iyada oo loo marayo cutubkeeda aasaaska.
"Baakadaha 3D waxay yareeyaan isticmaalka korontada iyo dib u dhaca habaynta, iyagoo hagaajinaya tayada calaamadaha korontada ee jajabyada semiconductor-ka," ayuu yiri sarkaal ka tirsan Samsung Electronics. Sannadkii 2027, Samsung waxay qorsheyneysaa inay soo bandhigto tignoolajiyada isku-dhafka ah ee isku-dhafan oo isku dhafan oo ku daraya walxaha indhaha ee si weyn u kordhiya xawaaraha gudbinta xogta ee semiconductor-yada hal xirmo oo midaysan oo ah dardar-geliyayaasha AI.
Iyadoo la raacayo baahida sii kordheysa ee jajabyada awoodda yar leh ee waxqabadka sare leh, HBM waxaa la saadaalinayaa inay ka koobnaan doonto 30% suuqa DRAM sanadka 2025 laga bilaabo 21% sanadka 2024, sida laga soo xigtay TrendForce, oo ah shirkad cilmi baaris oo Taiwan ah.
Cilmi-baarista MGI waxay saadaalineysaa in suuqa baakadaha ee horumarsan, oo ay ku jiraan baakadaha 3D, uu kori doono ilaa $80 bilyan marka la gaaro 2032, marka la barbar dhigo $34.5 bilyan sanadka 2023.
Waqtiga boostada: Juun-10-2024